Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
James J. Licari, Dale W. Swanson
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
Категории:
Година:
2007
Издание:
1st
Издателство:
William Andrew
Език:
english
Страници:
480
ISBN 10:
0815516002
ISBN 13:
9780815516002
Файл:
PDF, 4.07 MB
IPFS:
,
english, 2007
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